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Frequently Asked Questions

Frequently asked PCB manufacturing and assembly questions

Thermal Dissipation PCBs

  • Excessive heat can damage components, reduce signal integrity, and shorten product lifespan. Effective thermal management ensures stable performance, reliability, and long-term durability.

  • High-conductivity dielectrics such as PTFE, ceramic-filled laminates, and specialized resin systems outperform standard FR-4 by conducting heat away from critical components.

  • Thermal vias transfer heat vertically through the board into copper planes or heat sinks, significantly lowering component temperatures and spreading heat more evenly.

  • Copper coins are embedded or bonded inserts that act as localized heat sinks under hot components, providing highly efficient thermal transfer without increasing board thickness.

  • Summit partners with engineers early in design, recommending materials, via structures, and heat-sinking strategies to ensure manufacturable, reliable, and cost-effective thermal solutions.

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