Field Application Engineering Support
Summit’s Field Application Engineering department is available to answer technical questions and help customers implement good design for manufacturability practices. This team also provides feedback on PCB designs, drawings, stackups, and impedance.
Design for Manufacturing Reports
Summit has two types of DFM reports to help create a reliable and cost-effective design. These reports help eliminate potential holds and get PCBs in your hands without unnecessary delays.
This automated report is delivered in 1-2 days. It includes visuals and findings on design rules including:
- Minimum spacing violation
- Minimum width violation
- Annular ring violation
- Minimum PTH to copper violation
- Netlist validation
- and more.
This custom report includes visuals, detailed findings, and solutions. Typically delivered in 3-5 days, it gives you feedback on design specifications such as:
Board Outline Clearance
Drill Diameter (Pad Diameter)
Drill to Copper Clearance
Minimum Conductor Width
Clearance to Traces
Clearance to Pads
Clearance to Copper Fill
We also provide preliminary stackup documents, which include:
- Impedance calculations
- Line width & spacing
- Copper weight and thickness
- Plated layers
- Dielectric thickness
- Layer types
- Overall thickness
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Additional technical resources
Build a Better Via Stack
Designing a Layer Stack
DFM / DFA – What Is It? How Does It Work?
IPC -2221B Section 10.1.4 Conductor Spacing
IPC Rule for Land Sizes for a Plated Mechanically Drilled Hole
IPC-4761 Via Protection Buried Vias Type V versus Type VII
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