What is New in IPC-6012 Revision F?
IPC recently released an update to IPC-6012. Revision F covers qualification and performance specifications for …
10 Causes of Lamination Voids and Ways Designers Can Prevent Them
One of the challenges in printed circuit board (PCB) manufacturing is the occurrence of lamination …
How to Thoughtfully Design Embedded Cavities into a PCB
The increasing demand for compact, high-performance and reliable electronic devices requires novel solutions to address …
Mt. Kilimanjaro Climb
Two of Summit’s team members traveled to Tanzania, East Africa, last week to climb Mt. …
Mastering Impedance Tables: A Comprehensive Guide for Designers
When it comes to designing PCBs (Printed Circuit Boards) and ensuring their successful fabrication, an …
Summit Interconnect Included on the Inc. 5000 List for a Third Consecutive Year
Summit Interconnect, one of the largest PCB manufacturers in North America, today announced that for …
Addressing the Oncoming PFAS Ban
The European Chemicals Agency (ECHA) is proposing a broad ban on perfluoroalkyl and polyfluoroalkyl substances …
Summit Interconnect Welcomes Brian Kamradt as New Chief Financial Officer
June 28, 2023, Anaheim, CA – Summit Interconnect today announced the appointment of Brian Kamradt …
Summit’s Internship Program Kicks Off in Santa Ana
Aspiring young professionals began their interships at Summit’s Santa Ana location. The day was filled …
How Your PCB Manufacturer Can Drive Your Success
Boris Berezovsky Joins Summit as VP of Finance and Accounting
Summit Interconnect today announced that Boris Berezovksy has joined the company as Vice President of …
Advanced Assembly, A Summit Interconnect Company, Video Tour
