We manufacture a broad range of PCB types and technologies for a one-stop solution
Summit’s rigid capabilities include HDI high-layer count boards, staggered microvias, blind/buried vias, back drilling, multiple sequential lam, via fill, metal backed/metal core, and oversized panel options.
As experts in rigid-flex and flex manufacturing, we handle rigid-flex, bookbinder, multilayer, adhesiveless & adhesive, stiffeners, laser ablation, thin flex laminates, assembly options and more.
Our RF expertise includes using a wide range of PTFE materials, mixed material stackups, plated cavities, edge plating, high-temp lamination, mode suppression/stitching, buried resistors, and edge launch features.
We specialize in semiconductor reference cards, probe cards, DUT, and burn-in-boards. Our RF capabilities include high aspect ratio, low-loss materials, bondable gold, tight tolerance drilling, and sintering.
A few of the markets we serve
Summit is one of the most trusted suppliers for key defense programs with advanced technologies across a wide spectrum of platforms. We maintain ITAR registration and certifications for AS9100, Nadcap, and Mil Spec.
Summit is on the leading edge in the use of modern materials and HDI processes to meet the high-speed digital signal integrity requirements of the computing and datacom markets,
Summit has proven experience meeting the manufacturing requirements for medical electronic products including miniaturization with thin dielectrics, laser drilled vias and tight tolerances.
Summit has extensive experience supporting the semiconductor industry across many applications including ATE boards, probe cards, reference boards, and substrates.
Our material expertise and manufacturing knowledge allow Summit’s factories to support 6012/6018 Space Addendum for complex designs of space applications.
Global reach, local impact
Summit Interconnect’s eight facilities feature cutting-edge capabilities, ultra-efficient processes, the most experienced teams, and a culture dedicated to exceeding expectations.