A Full Service Offering
Mission-Critical prototype to production PCBs
Summit’s highly advanced manufacturing capabilities enable us to dependably build the most complex boards in the world. But we are never content with the status quo. Our teams work alongside customers to push the boundaries of what is possible, helping to create truly astonishing electronic products.
Looking to test your design before committing to a full PCB production run? At Summit Interconnect your small-quantity prototype PCBs are manufactured with the same state-of-the-art equipment and quality processes used to manufacture production PCBs.
High-Density (HDI) PCBs
Due to the growing complexity of design structures, high-density circuit boards (HDI) are becoming essential in today’s electronics. As products increase in functionality and decrease in size and weight, circuit board designers need new solutions to maximize the space on each board. For example, although blind and buried vias and vias-in-pad add complexity to the design, these features add more functionality without adding space.
Summit Interconnect has the expertise and HDI technology to route highest density designs.
Types of HDI
HDI designs typically include:
Through vias from surface to surface
Buried vias with through vias
Two or more HDI layers with through vias
Laser drill micro vias
Passive substrate with no electrical connection
Rigid PCB capabilities highlights
- Multiple material options and surface finishes
- Blind, buried and micro via structures
- Stacked and staggered microvias
- Multiple sequential lamination
- Via fill (conductive and non-conductive)
- View all capabilities
Additional rigid and HDI resources
Let Me Vent!
PCB Design Annular Ring
PCB Fabrication Basics: How Traces Are Made
11 Ways to Get Your PCBs Faster
IPC -2221B Section 10.1.4 Conductor Spacing
IPC Rule for Land Sizes for a Plated Mechanically Drilled Hole
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