RF/microwave signals are highly sensitive to the impact of noise, crosstalk, and power.
There are many considerations when integrating RF onto PCBs, including tight-component densities, multiple surface finish possibilities, board thickness considerations, wide ranges of reliability requirements, and even substrate-material choices. In addition, RF/microwave designs can require special manufacturing equipment. Fortunately, Summit has made significant investment in the equipment and field application engineering experience required for accurately manufacturing these PCBs.
Summit RF / microwave PCB capabilities
- Wide range of high-speed, low-loss materials
- Combination surface finishes
- Hybrid material stackups
- Tight tolerance stripline
- HDI/PTH mode suppression
- Ticer/Ohmega resistors and filters
- Plated cavities and edges
- Controlled depth milling
- Bonded heat sinks
- View all capabilities
We’re available to answer any questions.
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