Join our VP of Technology, Gerry Partida, as he discusses the challenges of delamination in HDI Design. In this 45-minute webinar exclusively for Summit Interconnect customers, Gerry shares why modern HDI designs with high copper retention and extensive microvias are more prone to moisture entrapment and teaches practical strategies to mitigate these issues and ensure the reliability of your PCB assemblies.
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WEBINAR: Mastering PCB Thermal Management
Managing heat in PCB design is critical for performance, reliability, and product longevity. Join Summit Interconnect for an insightful webinar where we explore progressive thermal management techniques—from fundamental material choices to advanced heat…
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WEBINAR: Best Practices for HDI and Sub-Lamination Structures
High-density interconnect (HDI) and sub-lamination PCBs provide enhanced functionality and compact designs. In this webinar, industry veteran Gerry Partida, Summit's Vice President of Technology, discusses important design best practices for HDI and sub-lamination…
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