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Let It Vent Webinar

Join our VP of Technology, Gerry Partida, as he discusses the challenges of delamination in HDI Design. In this 45-minute webinar exclusively for Summit Interconnect customers, Gerry shares why modern HDI designs with high copper retention and extensive microvias are more prone to moisture entrapment and teaches practical strategies to mitigate these issues and ensure the reliability of your PCB assemblies.

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