Managing heat in PCB design is critical for performance, reliability, and product longevity. Summit Interconnect’s webinar explored progressive thermal management techniques—from fundamental material choices to advanced heat dissipation solutions.
More Webinars
29
May
May 29, 2025 11:00 AM PT
WEBINAR: Pushing the Limits: High-Density PCB
This exclusive webinar will explore the evolving landscape of high-density PCBs.
Register Here
07
NOV
Nov 07, 2024 11:00 AM PT
WEBINAR: Best Practices for HDI and Sub-Lamination Structures
High-density interconnect (HDI) and sub-lamination PCBs provide enhanced functionality and compact designs. In this webinar, industry veteran Gerry Partida, Summit's Vice President of Technology, discusses important design best practices for HDI and sub-lamination…
Click to Watch