RECORDING: The Proliferation of Electronics into Harsh Environments and the Effects on Reliability
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For the past 30 years, the use of no-clean fluxes has, for
many assemblers, resulted in the successful abandonment
of post-reflow cleaning.
Today, an increasing number of assemblers are restoring
their long-abandoned cleaning process, so much so, that
cleaning is now considered by many assemblers, once
again, to be a mainstream assembly process.
This presentation will review the reasons cleaning, for many
assemblers, was abandoned, the reasons that decision was
largely successful for such a long time, and the reasons why
that success has faded.
The webinar will be hosted by Summit Interconnect and will be taking place at 11 AM PST, July 25th 2024. Register below.
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High-density interconnect (HDI) and sub-lamination PCBs provide enhanced functionality and compact designs. In this webinar, industry veteran Gerry Partida, Summit's Vice President of Technology, discusses important design best practices for HDI and sub-lamination…
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