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Free Webinar Next Thursday, 2/22, at 11 am PST | Learn what’s new in IPC 6012 Rev. F. | Guest Speaker will be Gerry Partida, Summit’s VP of Technology | Space is Limited

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Lamination

From simple 2-layer boards to highly complex stack ups, we have the ability to fabricate all types of printed circuit boards.

Board Details Standard Advanced Emerging
Layer Count 2-30 32+ >48
Minimum panel size 12″ x 18″
Maximum panel size 18″ x 24″ 21″ x 24″ 24″ x 30″
HDI layers 2 – 3 4 8+ as permitted by laminate type
Sequential laminations 2 – 3 4 8+ as permitted by laminate type
Layer-to-layer registration +/- .002″

Thickness

Design and manufacturing factors usually determine the thickness of PCBs.

Thickness Standard Advanced Emerging
Minimum board thickness, single/double sided .005″ 002″
Maximum board thickness .250″ .300″
Minimum core thickness .001″ .0005″
Minimum core thickness (BC, Kapton) .002″ .001″ .0005″
Minimum prepreg fill .003″ .002″ <.002"

Drill and Mill

PCB drilling and milling creates holes, slots, and other cavities in an electronic circuit board.

Drill and Mill Standard Advanced Emerging
Minimum drill diameter, mechanical drill .006″ .005″ .004″
Mechanical drill aspect ratio, unfilled 12:01 15:01 30:1
Mechanical drill aspect ratio, filled 10:01 11:01 > 11:1
Drill to metal (rigid) .008″ .007″ .00525″
Drill to metal (flex) .012″ .007″ .00525″
Drill edge to rigid flex transition .100″ .075″ < .050"
Antipad diameter over drill size .020″ + .016″ < .050"
Minimum class 2 annular ring, mechanical drill .005″ .004″ <.004"
Minimum class 3 annular ring, mechanical drill .007″ .006″ <.006"
Minimum drill diameter, laser micro via .004″ .003″ <.003"
Microvia aspect ratio 0.6:1 0.7:1 >0.7:1
Microvia capture pad / hole +.007″ +.005″ +.004″
Control depth drill tolerance Keep back .010″ +/- .005″ Keep back .005″ +/- .002″ Keep back .004 +/- .0015″
Back drill, diameter over primary drill .008″ .007″ <.007"
Back drill anti-pad, diameter over primary drill .016″ .014″ <.014"

Etch Features

Copper is one of the most important elements in printed circuit boards. The current carrying capacity of a PCB depends on the thickness of the copper trace.

Copper traces are made by using chemicals to etch or remove copper from the board except where the wired connections are present.

Etch Features Standard Advanced Emerging
Minimum copper foil – internal 1/2 oz. 1/4 oz. 1/4 oz.
Maximum copper foil – internal 2 oz. 4 oz. 6 oz
Minimum copper foil – external 3/8 oz. 1/4 oz. 1/4 oz
Maximum copper foil – external 1 oz. 3 oz. >3 oz

Inner and External Layers Print and Etch

Trace width and spacing requirements are based on the functionality of the circuit. They can affect electrical performance and signal integrity.

Inner Layers Standard Advanced Emerging
Minimum designed line width/spacing, 1/4 ounce foil .002″ <.002"
Minimum designed line width/spacing, 3/8 ounce foil .003″/.003″ .0025″/.003″ <.0025"/.002"
Minimum designed line width/spacing, 1/2 ounce foil .004″/.004″ .003″/.003″ <.0025"/.002"
Minimum designed line width/spacing, 1 ounce foil .005″/.005″ .004″/.004″ .0035″/.004″
Minimum designed line width/spacing, 2 ounce foil .008″/.008″ .006″/.008″ .006″/.006″
Minimum designed line width/spacing, 3 ounce foil .010″/.010″ .008″/.010″ .008″/.008″
Plated External Layers Standard Advanced Emerging
Minimum designed line width/spacing, 1/4 ounce foil .0025″/.0025″ .002″/.002″
Minimum designed line width/spacing, 3/8 ounce foil .004″/.004″ .003″/.003″ .0025″/.003″
Minimum designed line width/spacing, 1/2 ounce foil .005″/.005″ .004″/.004″ .003″/.004″
Minimum designed line width/spacing, 1 ounce foil .006″/.006″ .005″/.005″ .004″/.005″
Minimum designed line width/spacing, 2 ounce foil .012″/.012″ .010″/.010″ .008″/.008″
Copper fill to round feature spacing (donuts) .006″ .005″ .005″

Soldermask

Soldermask is a thin layer of polymer that protects PCBs from oxidation and corrosion. It also helps avoid solder bridges and gives color to the board.

Soldermask Standard Advanced Emerging
LDI solder mask minimum web width, green color .004″ .003″ less than .003″
LDI solder mask clearance +/-.002″ +/-.0015″ less than +/- .0015″

Legend

With more PCBs moving towards high-density, flex, and component miniaturization, the quality and readability of a legend is more important than ever.

Legend Standard Advanced Emerging
Inkjet legend printing White White White
Color options Green Red, Blue, Black, White Red, Blue, Black, White

Mechanical

Mechanical Standard Advanced Emerging
Board profile dimensional tolerance +/- .005″ +/- .002″ <+/- .002"
Plated through hole diameter tolerance +/-.003″ +/-.002″ <+/- .002"
Non-plated through hole diameter
tolerance
+.002″/
-.001″
+/-.001″ <+/- .001"
Flatness, warp and twist Per IPC-TM-650 2.4.22 <.75% <.5% Balanced
Construction
Unbalanced
Constructions AABUS

Impedance Testing

Impedance Testing Standard Advanced Emerging
Impedance controlled – single ended +/- % +/- 10% +/- 5% <+/- 2%
Impedance controlled – edge couped diff. +/- % +/- 10% +/- 8% <+/- 5%
Impedance controlled – broad side diff. +/- % +/- 10% +/- 8% +/- 5%

Electroplating

The electroplating process deposits metal onto the surface of the circuit board and inside the plated through-holes. The most common plated metal is copper.

Electroplating Standard Advanced
Low Stress Nickel 100 Microinches 250 Microinches
Gold Plating Thickness 30 Microinches As Specified
Hole Aspect Ratio 12 to 1 20 to 1

Finishes

The finish of a board, which is sometimes overlooked, is the interface between the board and the components that make the board function as desired.

Finishes Standard Advanced
HASL & HASL PB FREE Yes Yes
White Tin Yes Yes
Electroless Nickel/Palladium/Gold -ENEPIG Yes Yes
Electroless Nickel/Immersion Gold – ENIG Yes Yes
Immersion Silver Yes Yes
Entek Plus HT/OSP Yes Yes

Vias

Vias make electrical connections between layers on a printed circuit board. They can carry signals or power between layers. Summit specializes in advanced PCB technologies such as blind vias, buried vias, and via-in-pads.

Types of Vias Standard Advanced
Laser Micro Vias .006″ <.006"
Blind / Buried Vias .006″ < .006″
Via in Pad Yes Yes
Via Fill Standard Advanced
Non-Conductive ViaFill Yes Yes
Silver / Conductive Epoxy Via Fill No Yes
Copper Filled Vias No Yes
Through Hole Copper Filled Via No Max 20 mils

Inspection Processes and Options

Thorough testing and inspection occurs throughout the production process to ensure problems are captured early on, ensuring high quality and yield.

Inspection Processes Standard Advanced
Flying Probe Net List Test Yes Yes
Impedance Control TDR Yes Yes
AOI Inspection & Hi-Pot Testing Yes Yes
Thermal Stress Yes Yes
Peel Test Yes Yes
Cross Section Pucks Yes Yes
Solderability Yes Yes
Impedance Coupons Yes Yes
AB Coupon Yes Yes

Panelized Board Size

Due to our advanced operational capacity and nearly limitless flexibility, we can assemble more PCBs faster than anyone else in the industry.

Board Details Standard Advanced
Board Size .25″ x .25″ minimum size, panelized 17″ x 21″

Processes

Our assembly facility utilizes the latest technology and equipment, and we always keep tabs on industry trends and customer demand to make sure our capabilities meet your PCBA needs.

Assembly Processes Standard Advanced
3, 5, and 10-Day Turns Yes Yes
Single-Sided SMT Yes Yes
Double-Sided SMT Yes Yes
Through Hole Yes Yes
No Clean Yes Yes
Clean / Wash Yes Yes
ROHS and Leaded Yes Yes
Additional Assembly Processes Standard Advanced
Press Fits Yes Yes
Box Build Yes Yes
Fine Pitch to 08 Mils .08 Mils .04 Mils
BGA Repair and Reball Yes Yes
Part Removal and Replacement Yes Yes
Underfill No Yes
Staking No Yes
Conformal Coating No Yes
Fencing and Shields No Yes

Components

We provide full turnkey PCB assembly and manufacturing to help our customers across the country complete their projects on time. Our close and authentic partnerships with the most reputable US-based component and board suppliers is at the heart of the process.

Components Standard Advanced
SOIC Yes Yes
QFP Yes Yes
TQFN Yes Yes
Leadless Yes Yes
Through Hole Yes Yes
LGA Yes Yes
Passives Down to 0201 Down to 01005
BGAs, uBGA, and VFBGA Yes Yes
Leadless Chip Carriers/ CSP Yes Yes
Microelescronics Yes Yes
Package-on-Package Yes Yes
Flip Chips Yes Yes
Hardware No Yes
Component Packaging Standard Advanced
Cut Tape Yes Yes
Loose Parts Yes Yes
Reels Yes Yes

Soldering Types & Methods

Soldering is one of the most basic techniques to understand for PCB assembly. Serving as a connective and conductive glue, a solid solder brings continuity and functionality to any circuit board.

Soldering Options Standard Advanced
Jet Paste Printing Yes Yes
Stencil/Water Soluble Paste No Yes
Vapor Phase Reflow No Yes
Conventional Reflow Yes Yes
Wave Solder / Selective Solder Yes Yes
Programmable Selective Solder No Yes

Inspection & Testing

Inspection is a critical part of the PCB assembly process. Without it, electronics manufacturers would never know for sure whether the PCB—and therefore the device—would work properly.

Inspection Processes Standard Advanced
Flying Probe No Yes
3D BGA X-Ray Yes Yes
Functional Testing No Yes
In-Line AOI Yes Yes
Visual Inspection Yes Yes
Component Inspection Yes Yes
Component Value Check Yes Yes
Ionic Contamination Test No Yes

Quality Standards

Following quality standards ensures all aspects of a PCB design are correctly implemented and the end products perform exactly as expected.

Quality Standards Standard Advanced
AS9100D Yes Yes
AS9102 FAIR No Yes
IPC Class II Yes Yes
IPC Class III No Yes
ITAR Certified Yes Yes
RoHS Compliant Yes Yes

Depanelization Methods

Once the boards are assembled and tested, they will need to be separated into their individual parts. There are many methods of depaneling PCBs, and which one you use depends on the type of panelization you chose.

Depanelization Methods Standard Advanced
V-Score Yes Yes
Mouse Bites Yes Yes
Mechanical Routing No Yes

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