WEBINAR: Pushing the Limits: High-Density PCB

WEBINAR: Best Practices for HDI and Sub-Lamination Structures

High-density interconnect (HDI) and sub-lamination PCBs provide enhanced functionality and compact designs. In this webinar, industry veteran Gerry Partida, Summit's Vice President of Technology, discusses important design best practices for HDI and sub-lamination…

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RECORDING: Mastering PCB Thermal Management

Managing heat in PCB design is critical for performance, reliability, and product longevity. Summit Interconnect's webinar explored progressive thermal management techniques—from fundamental material choices to advanced heat dissipation solutions.