Clay Swain

It is with profound sadness that we announce the passing of Clay Swain this past weekend. Clay was an integral part of Summit Interconnect from the very beginning—joining the company just six weeks after it was founded. He brought a spirit of optimism, warmth, and dedication that helped shape Summit’s culture and values. His impact on our team and our customers was immeasurable.

With a career that spanned decades in the printed circuit board industry, Clay was widely respected for his integrity, passion, and leadership, and he was instrumental in building lasting relationships across the industry.  Clay began his PCB industry career as an Account Manager at Lundahl Astro Circuits in Logan, Utah, where he quickly distinguished himself through his natural ability to connect with customers. From there, he advanced to roles at the Tyco Printed Circuit Group and then at TTM Technologies.  In 2016, Clay joined Summit’s leadership team as Senior Vice President of Sales & Marketing. Throughout his tenure with Summit, Clay led with vision and integrity. He played a pivotal role in our company’s ongoing growth and success—earning the admiration of colleagues, customers, and partners alike.

Clay’s contributions extended far beyond his professional roles. He had a kindness and enthusiasm that inspired everyone around him, whether he was engaging with customers or leading his team. His genuine interest in people left a lasting impression on all who knew him.  “Clay brought tremendous energy to our company and much of our early success is attributed to him,” said Shane Whiteside, CEO and Chairman of Summit Interconnect. “We will miss his warm smile and relentlessly positive approach to everything in life and work.”

As we move forward, Clay’s presence will be deeply missed, but his legacy will continue to guide how we serve our customers and support one another.

We invite all who knew Clay—customers, partners, teammates, and friends—to join us in celebrating his life and the indelible mark he left on all of us.

—The Summit Interconnect Team