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Mar 21, 2024 11:00 AM

RECORDING: What’s New in IPC 6012 Revision F? Part II

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Attendees were so engaged in last month’s webinar that Gerry Partida only had time to discuss a few of the changes to IPC 6012 Rev. F. That’s no problem though because we are adding a second webinar, “What’s New in IPC-6012? Part II.” Join us for this informative discussion to review a few more of the recent changes and their potential impact on your next PCB designs.

Topics to be covered:

  • Printed Board Cavities (3.3.10)
  • Evidence of Etchback (
  • Total Copper Penetration / Evaluation of Etchback (
  • Dimples and Protrusions (
  • Plated Internal Layers (
  • Minimum Dielectric Spacing (

Gerry’s insights are based on 38+ years in the PCB industry.  He is the Co-Chair of IPC-6012/IPC-A-600 and committee member with IPC-6018, IPC-1601, IPC-2221, IPC-2222 and other standard committees.

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25 Jul
Jul 25, 2024 11:00 AM PST

Webinar: The Proliferation of Electronics into Harsh Environments and the Effects on Reliability

For the past 30 years, the use of no-clean fluxes has, for many assemblers, resulted in the successful abandonment of post-reflow cleaning. Today, an increasing number of assemblers are restoring their long-abandoned cleaning…

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20 Jun
Jun 20, 2024 11:00 AM PT

RECORDING: Let It Vent Webinar

Join our VP of Technology, Gerry Partida, as he discusses the challenges of delamination in HDI Design. In this 45-minute webinar exclusively for Summit Interconnect customers, Gerry shares why modern HDI designs with…

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