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What’s New in IPC 6012 Revision F? Part II

Attendees were so engaged in last month’s webinar that Gerry Partida only had time to discuss a few of the changes to IPC 6012 Rev. F. That’s no problem though because we are adding a second webinar, “What’s New in IPC-6012? Part II.” Join us for this informative discussion to review a few more of the recent changes and their potential impact on your next PCB designs.
Topics to be covered:
Printed Board Cavities (3.3.10)
Evidence of Etchback (3.6.2.6.1)
Total Copper Penetration / Evaluation of Etchback (3.6.2.6.2)
Dimples and Protrusions (3.6.2.11.3)
Plated Internal Layers (3.6.2.14.1)
Minimum Dielectric Spacing (3.6.2.18.1)

Gerry’s insights are based on 38+ years in the PCB industry. He is the Co-Chair of IPC-6012/IPC-A-600 and committee member with IPC-6018, IPC-1601, IPC-2221, IPC-2222 and other standard committees.

Recording