RECORDING: What’s New in IPC 6012 Revision F? Part II

Attendees were so engaged in last month’s webinar that Gerry Partida only had time to discuss a few of the changes to IPC 6012 Rev. F. That’s no problem though because we are adding a second webinar, “What’s New in IPC-6012? Part II.” Join us for this informative discussion to review a few more of the recent changes and their potential impact on your next PCB designs.

Topics to be covered:

• Printed Board Cavities (3.3.10)
• Evidence of Etchback (3.6.2.6.1)
• Total Copper Penetration / Evaluation of Etchback (3.6.2.6.2)
• Dimples and Protrusions (3.6.2.11.3)
• Plated Internal Layers (3.6.2.14.1)
• Minimum Dielectric Spacing (3.6.2.18.1)

Gerry’s insights are based on 38+ years in the PCB industry.  He is the Co-Chair of IPC-6012/IPC-A-600 and committee member with IPC-6018, IPC-1601, IPC-2221, IPC-2222 and other standard committees.