RECORDING: What’s New in IPC 6012 Revision F? Part II
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Attendees were so engaged in last month’s webinar that Gerry Partida only had time to discuss a few of the changes to IPC 6012 Rev. F. That’s no problem though because we are adding a second webinar, “What’s New in IPC-6012? Part II.” Join us for this informative discussion to review a few more of the recent changes and their potential impact on your next PCB designs.
Topics to be covered:
- Printed Board Cavities (3.3.10)
- Evidence of Etchback (3.6.2.6.1)
- Total Copper Penetration / Evaluation of Etchback (3.6.2.6.2)
- Dimples and Protrusions (3.6.2.11.3)
- Plated Internal Layers (3.6.2.14.1)
- Minimum Dielectric Spacing (3.6.2.18.1)
Gerry’s insights are based on 38+ years in the PCB industry. He is the Co-Chair of IPC-6012/IPC-A-600 and committee member with IPC-6018, IPC-1601, IPC-2221, IPC-2222 and other standard committees.
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WEBINAR: Best Practices for HDI and Sub-Lamination Structures
High-density interconnect (HDI) and sub-lamination PCBs provide enhanced functionality and compact designs. In this webinar, industry veteran Gerry Partida, Summit's Vice President of Technology, discusses important design best practices for HDI and sub-lamination…
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