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Oct 26, 2023 11:00 AM
RECORDING: Microvia Reliability Stacking and Staggering for a Successful Design
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Microvias are used to allow High Density Interconnections (HDI). However, designing with microvias began without a thorough understanding of the reliability of the HDI connections, especially when multiple-depth microvias were utilized.
Watch this free webinar to learn from the Summit’s VP of Technology, Gerry Pardita, when and where it may be possible to stack microvias many levels deep, and where in the same design that staggering of microvias is necessary at every level.
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NOV
Nov 07, 2024 11:00 AM PT
WEBINAR: Best Practices for HDI and Sub-Lamination Structures
High-density interconnect (HDI) and sub-lamination PCBs provide enhanced functionality and compact designs. In this webinar, industry veteran Gerry Partida, Summit's Vice President of Technology, discusses important design best practices for HDI and sub-lamination…
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