Microvias are used to allow High Density Interconnections (HDI). However, designing with microvias began without a thorough understanding of the reliability of the HDI connections, especially when multiple-depth microvias were utilized.
Watch this free webinar to learn from the Summit’s VP of Technology, Gerry Pardita, when and where it may be possible to stack microvias many levels deep, and where in the same design that staggering of microvias is necessary at every level.
This exclusive webinar will explore the evolving landscape of high-density PCBs.
Register HereManaging heat in PCB design is critical for performance, reliability, and product longevity. Summit Interconnect's webinar explored progressive thermal management techniques—from fundamental material choices to advanced heat dissipation solutions.
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