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Jun 20, 2024 11:00 AM

Let It Vent Webinar

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Join our VP of Technology, Gerry Partida, as he discusses the challenges of delamination in HDI Design. In this 45-minute webinar exclusively for Summit Interconnect customers, Gerry shares why modern HDI designs with high copper retention and extensive microvias are more prone to moisture entrapment and teaches practical strategies to mitigate these issues and ensure the reliability of your PCB assemblies.

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22 May
May 22, 2024 08:00 AM PDT

RECORDING: Addressing the Challenges of PCB Design for Manufacturing

We had an excellent turnout at our latest webinar in the series, where we discussed Addressing the Challenges of PCB Design for Manufacturing along with CoFactr. Some topics that were covered include: Common…

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24 Apr
Apr 24, 2024 11:00 AM PST

RECORDING: How AI is Shaping the Future of Electronics Design

In this 45-minute webinar exclusively for Summit Interconnect customers and partners, Sergiy shares his thoughts on this latest wave of disruptive technology and how it’s already beginning to shape the future of electronic…

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