Join our VP of Technology, Gerry Partida, as he discusses the challenges of delamination in HDI Design. In this 45-minute webinar exclusively for Summit Interconnect customers, Gerry shares why modern HDI designs with high copper retention and extensive microvias are more prone to moisture entrapment and teaches practical strategies to mitigate these issues and ensure the reliability of your PCB assemblies.
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RECORDING: The Proliferation of Electronics into Harsh Environments and the Effects on Reliability
For the past 30 years, the use of no-clean fluxes has, for many assemblers, resulted in the successful abandonment of post-reflow cleaning. Today, an increasing number of assemblers are restoring their long-abandoned cleaning…
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RECORDING: Addressing the Challenges of PCB Design for Manufacturing
We had an excellent turnout at our latest webinar in the series, where we discussed Addressing the Challenges of PCB Design for Manufacturing along with CoFactr. Some topics that were covered include: Common…
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