Advanced Thermal Management PCB Solutions

Effective heat management is essential to prevent component failure, ensure signal integrity, and extend product life. Summit delivers advanced materials and design techniques that keep boards cool and reliable.

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Heat Dissipation Solutions

Managing heat is critical to PCB performance, reliability, and product lifespan. Excessive temperatures can degrade components, weaken solder joints, and compromise signal integrity. Effective thermal management uses conductive materials, vias, copper planes, and heat-sinking strategies to spread and remove heat efficiently.

Summit offers advanced thermal solutions engineered to keep designs running cooler and more reliably.

Essential Thermal PCB Features

Materials with high thermal conductivity improve heat flow.
Copper planes and heavier copper spread heat evenly.
Thermal vias transfer heat away from hot components.
Embedded coins deliver targeted, localized heat sinking.
Integrated heat sinks enhance dissipation and stability.

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Designing for Thermal Reliability

Managing heat starts with smart design choices. Material selection, stack-up configuration, via structures, and heat-spreading features all influence how effectively a PCB performs under thermal stress.

By combining advanced analysis with practical fabrication experience, Summit helps customers implement effective heat dissipation strategies.

Design Support Highlights

Guidance on material selection for conductivity and reliability.
Stack-up optimization to balance thermal and electrical needs.
Via design recommendations for effective heat transfer.
Expertise in copper coin and heat sink integration.
Early DFM collaboration to reduce rework and risk.

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Capabilities

Thermal Management capabilities highlights

High-Conductivity Dielectric Materials 

Improve heat transfer through the PCB structure. Summit's expertise with advanced laminates ensures the right material is matched to performance needs.
Heavy Copper and Copper Planes 

Spread heat evenly and increase current capacity. Our proven processing of thick copper and plane layers delivers reliable thermal and electrical performance.
Thermal Vias 

Move heat away from hot components efficiently. Our technologies maximize conductivity and reliability to optimize via design, plating, and fill.
Copper Coin Technology 

Provide localized heat sinking at critical components. At Summit, embedded or bonded copper coins are engineered with precision for effective thermal transfer.
Integrated Heat Sink Solutions 

Enhance dissipation in high-power applications. Summit's expertise in bonded aluminum and copper sinks ensures secure attachment and thermal performance.
Controlled Depth Milling 

Create cavities for coins, sinks, or embedded cooling. Our precision milling capability enables accurate thermal features without compromising board integrity.

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Embedded Heat Sink Strategies Reference Guide.

Learn how to embedded heat sinks into a PCB cavity to extract thermal energy from high-power components

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We’re available to answer any questions

Email Us
info@summitinterconnect.com
Call Us
+1 (877) 264-0343

FAQ

Frequently asked questions.

Excessive heat can damage components, reduce signal integrity, and shorten product lifespan. Effective thermal management ensures stable performance, reliability, and long-term durability.
High-conductivity dielectrics such as PTFE, ceramic-filled laminates, and specialized resin systems outperform standard FR-4 by conducting heat away from critical components.
Thermal vias transfer heat vertically through the board into copper planes or heat sinks, significantly lowering component temperatures and spreading heat more evenly.
Copper coins are embedded or bonded inserts that act as localized heat sinks under hot components, providing highly efficient thermal transfer without increasing board thickness.
Summit partners with engineers early in design, recommending materials, via structures, and heat-sinking strategies to ensure manufacturable, reliable, and cost-effective thermal solutions.