In this webinar, Gerry Partida, our Vice President of Technology, discusses what is new in IPC 6012 Revision F. Revision F covers qualification and performance specifications for rigid PCBs. Topics covered in this webinar include:
- Design considerations when a design has back drills in plated holes.
- New rules specifically addressing the incorporation of cavities within PCB designs.
- Requirements of edge plating that has been added to edges
- Changes in default requirements for Surface Finish ENIG, Dielectric Separation, and Lead Free Solder Coated Finish.
- Evidence of Etchback and Minimum Dielectric Spacing
- And much more!
Enter your name and email address in the Zoom Registration Page below, and you will receive the link to the live Webinar being hosted on February 22nd at 11:00 PST.
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