Join our VP of Technology, Gerry Partida, as he discusses the challenges of delamination in HDI Design. In this 45-minute webinar exclusively for Summit Interconnect customers, Gerry shares why modern HDI designs with high copper retention and extensive microvias are more prone to moisture entrapment and teaches practical strategies to mitigate these issues and ensure the reliability of your PCB assemblies.
More Webinars
29
May
May 29, 2025 11:00 AM PT
WEBINAR: Pushing the Limits: High-Density PCB
This exclusive webinar will explore the evolving landscape of high-density PCBs.
Register Here
13
March
Mar 13, 2025 11:00 AM
RECORDING: Mastering PCB Thermal Management
Managing heat in PCB design is critical for performance, reliability, and product longevity. Summit Interconnect's webinar explored progressive thermal management techniques—from fundamental material choices to advanced heat dissipation solutions.
Watch Recording