Join our VP of Technology, Gerry Partida, as he discusses the challenges of delamination in HDI Design. In this 45-minute webinar exclusively for Summit Interconnect customers, Gerry shares why modern HDI designs with high copper retention and extensive microvias are more prone to moisture entrapment and teaches practical strategies to mitigate these issues and ensure the reliability of your PCB assemblies.
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This webinar will provide engineers and PCB designers with practical insights into how IPC standards directly impact the speed, quality, and reliability of prototype PCB builds. Attendees will learn which IPC standards are…
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RECORDING: How Circuit Boards Are Built
Whether you’re new to PCB design or just need a refresher, this webinar walks you through the real-world process of how your designs are brought to life on the manufacturing floor. Led by…
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