High-density interconnect (HDI) and sub-lamination PCBs provide enhanced functionality and compact designs. In this webinar, industry veteran Gerry Partida, Summit’s Vice President of Technology, discusses important design best practices for HDI and sub-lamination structures.
This webinar will provide engineers and PCB designers with practical insights into how IPC standards directly impact the speed, quality, and reliability of prototype PCB builds. Attendees will learn which IPC standards are…
Register NowWhether you’re new to PCB design or just need a refresher, this webinar walks you through the real-world process of how your designs are brought to life on the manufacturing floor. Led by…
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