Ultra high density PCBs are printed circuit boards with:
- Lines and spaces below 50 microns
- Microvia diameters 75 microns and below
- Dielectric thicknesses below 50 microns
These boards are manufactured with modified Semi Additive Processing (mSAP) for lines and spaces 20 microns to 40 microns.
In this webinar presented by Herb Snogren, learn how technologies are converging to push the limits of PCB design.
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