Ultra high density PCBs are printed circuit boards with:
- Lines and spaces below 50 microns
- Microvia diameters 75 microns and below
- Dielectric thicknesses below 50 microns
These boards are manufactured with modified Semi Additive Processing (mSAP) for lines and spaces 20 microns to 40 microns.
In this webinar presented by Herb Snogren, learn how technologies are converging to push the limits of PCB design.
Related articles
Fabrication
06/04/25
How Embedded Heat Sinks Are Advancing PCB Fabrication
Managing localized thermal loads is increasingly critical as power densities rise. One solution to this ...
Manufacture
05/29/25
Bipartisan PCBs Act to Revitalize the Microelectronics Ecosystem
Washington, May 27, 2025 – The bipartisan Protecting Circuit Boards and Substrates Act of 2025 introduced ...
Fabrication
05/20/25
5 Key Considerations for Quality PCB Manufacturing: Materials, Processes, and Standards
Industrial PCB manufacturing requires precision, reliability, and strict quality control to meet the demands of ...