Summit Interconnect Enhances Assembly Capabilities with a Second Nikon XT V160 X-Ray System

Summit Interconnect is excited to announce the installation of a second Nikon XT V160 X-ray system in our Denver-based assembly facility. This state-of-the-art equipment enhances our ability to conduct high-precision inspections on complex printed circuit board assemblies (PCBAs), ensuring the highest level of quality for our customers. By leveraging automated pass/fail inspection and advanced imaging technology, this addition reinforces our commitment to innovation and reliability in PCB manufacturing.

Nikon XT V160 brings superior imaging capabilities, allowing us to capture clearer, high-resolution X-ray images of PCB components and assemblies. This level of detail is essential for identifying potential defects, verifying component placement, and ensuring compliance with stringent industry standards. The ability to provide customers with detailed X-ray scans on request further strengthens the transparency and trust in our processes.

With this second installation, Summit Interconnect significantly increases operational redundancy, ensuring that even if one system requires maintenance, assembly operations remain uninterrupted. This redundancy helps eliminate bottlenecks in the facility, enhancing throughput and efficiency while improving turnaround times for our customers. By reducing the risk of production delays, we continue to support the fast-paced demands of industries that rely on our cutting-edge PCB solutions.

Investing in advanced non-destructive testing (NDT) solutions like the Nikon XT V160 reflects our ongoing commitment to maintaining the highest quality standards. This latest upgrade not only improves our manufacturing processes but also supports our customers by delivering reliable, high-performance PCB assemblies with unmatched precision and confidence.

Stay tuned as we continue to implement the latest advancements in PCB technology to serve our customers better.

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