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Apr 24, 2024 11:00 AM
RECORDING: How AI is Shaping the Future of Electronics Design
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In this 45-minute webinar exclusively for Summit Interconnect customers and partners, Sergiy shares his thoughts on this latest wave of disruptive technology and how it’s already beginning to shape the future of electronic design.
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07
NOV
Nov 07, 2024 11:00 AM PT
WEBINAR: Best Practices for HDI and Sub-Lamination Structures
High-density interconnect (HDI) and sub-lamination PCBs provide enhanced functionality and compact designs. In this webinar, industry veteran Gerry Partida, Summit's Vice President of Technology, discusses important design best practices for HDI and sub-lamination…
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