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RECORDING: Microvia Reliability Stacking and Staggering for a Successful Design
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Microvias are used to allow High Density Interconnections (HDI). However, designing with microvias began without a thorough understanding of the reliability of the HDI connections, especially when multiple-depth microvias were utilized.
Watch this free webinar to learn from the Summit’s VP of Technology, Gerry Pardita, when and where it may be possible to stack microvias many levels deep, and where in the same design that staggering of microvias is necessary at every level.
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REGISTER: Designing for Space: Understanding the IPC-6012 Space Addendum
Designing PCBs for aerospace and space applications means engineering for the harshest environments imaginable — vacuum, radiation, thermal extremes, vibration, and shock. Failure is not an option, and the standards reflect that reality.…
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RECORDING: IPC Standards for Quick-Turn, Prototype PCB Assembly
This webinar provides engineers and PCB designers with practical insights into how IPC standards directly impact the speed, quality, and reliability of prototype PCB builds. Attendees will learn which IPC standards are most…
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