Summit Interconnect Announces Appointment of Leo LaCroix as Chief Operating Officer

September 9, 2025, Irvine, CA – Summit Interconnect, a leading North American manufacturer of Printed Circuit Boards (PCBs), supplying quick-turn through full-production across a wide range of complexities including Rigid-Flex, Rigid uHDI, RF, and Thermal Management technologies, today announced that Leo LaCroix has assumed the role of Chief Operating Officer (COO).

Leo brings more than 20 years of broad Printed Circuit Board operations management experience in senior level roles leading and developing cross functional teams across multiple facilities. He joined Summit in 2024 as Vice President of Aerospace & Defense Operations, where he quickly implemented data-driven solutions that significantly improved performance across Summit’s A&D business. As COO, Leo will apply his leadership and collaborative approach to drive operational excellence across Summit’s seven manufacturing facilities in the United States and Canada.

“Since joining our leadership team last year, Leo has made a tremendous impact on Summit,” said Shane Whiteside, President and CEO of Summit Interconnect. “His disciplined operational improvements and ability to drive alignment across functions have strengthened both our business performance and our culture. In his new role as COO, I am confident Leo will continue to elevate our operations and further position Summit for long-term growth and industry leadership.”

“I’m honored to step into this role as COO,” said Leo LaCroix. “Summit has an extraordinary team, and together we’ve already proven how quickly we can improve performance, build alignment, and overcome challenges. I look forward to continuing this momentum and ensuring Summit remains a leader in advanced PCB manufacturing.”

Leo holds a bachelor’s degree in international economy and policy studies from the University of Wisconsin–Madison with a concentration in International Business.

About Summit Interconnect: Summit Interconnect is the largest, privately held PCB manufacturer in North America, supplying quick-turn through full-production across a wide range of complexities, including Rigid-Flex, Rigid uHDI, RF, and Thermal Management technologies. The company is focused on the fast-growing defense and high-performance commercial sectors in the North American market. Summit’s seven facilities are located across California, Illinois, Colorado, and Toronto, Canada. For more information, please visit  summitinterconnect.com.