Stay Tuned for Details on Our Next Technical Webinar
07
NOV
Nov 07, 2024 11:00 AM PT
WEBINAR: Best Practices for HDI and Sub-Lamination Structures
High-density interconnect (HDI) and sub-lamination PCBs provide enhanced functionality and compact designs. In this webinar, industry veteran Gerry Partida, Summit's Vice President of Technology, discusses important design best practices for HDI and sub-lamination…
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03
OCT
Oct 03, 2024 12:00 AM PT
RECORDING: PCB Tech Match: How to Choose the Right PCB Technology for Your Application
Using the right technology for your PCB application reduces time to market, lowers costs, and delivers the best performance outcomes. In this webinar, industry veterans Mike Trammel, Summit’s Director of Product and Technology…
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25
Jul
Jul 25, 2024 11:00 AM PST
RECORDING: The Proliferation of Electronics into Harsh Environments and the Effects on Reliability
For the past 30 years, the use of no-clean fluxes has, for many assemblers, resulted in the successful abandonment of post-reflow cleaning. Today, an increasing number of assemblers are restoring their long-abandoned cleaning…
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