Managing heat in PCB design is critical for performance, reliability, and product longevity. Summit Interconnect's webinar explored progressive thermal management techniques—from fundamental material choices to advanced heat dissipation solutions.
Watch RecordingHigh-density interconnect (HDI) and sub-lamination PCBs provide enhanced functionality and compact designs. In this webinar, industry veteran Gerry Partida, Summit's Vice President of Technology, discusses important design best practices for HDI and sub-lamination…
Click to WatchUsing the right technology for your PCB application reduces time to market, lowers costs, and delivers the best performance outcomes. In this webinar, industry veterans Mike Trammel, Summit’s Director of Product and Technology…
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