Field Application Engineering Support
Summit’s Field Application Engineering department is available to answer technical questions and help customers implement good design for manufacturability practices. This team also provides feedback on PCB designs, drawings, stackups, and impedance.
Design for Manufacturing Reports
Summit has two types of DFM reports to help create a reliable and cost-effective design. These reports help eliminate potential holds and get PCBs in your hands without unnecessary delays.
DFM Check
This automated report is delivered in 1-2 days. It includes visuals and findings on design rules including:
- Minimum spacing violation
- Minimum width violation
- Annular ring violation
- Minimum PTH to copper violation
- Netlist validation
- and more.
Tooling DFM
This custom report includes visuals, detailed findings, and solutions. Typically delivered in 3-5 days, it gives you feedback on design specifications such as:
Board Outline Clearance
Board Thickness
Drill Diameter (Pad Diameter)
Drill to Copper Clearance
Conductor Width
Minimum Conductor Width
Clearance to Traces
Clearance to Pads
Clearance to Copper Fill
Stackup
We also provide preliminary stackup documents, which include:
- Stackup
- Impedance calculations
- Line width & spacing
- Copper weight and thickness
- Plated layers
- Dielectric thickness
- Layer types
- Materials
- Overall thickness
Contact Technical Support
Email Us
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Additional technical resources
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Article
09/02/20
Build a Better Via Stack
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Article
06/09/20
Designing a Layer Stack
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Video
04/03/20
DFM / DFA – What Is It? How Does It Work?
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Article
07/27/22
IPC -2221B Section 10.1.4 Conductor Spacing
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Article
09/22/22
IPC Rule for Land Sizes for a Plated Mechanically Drilled Hole
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Article
03/27/21
IPC-4761 Via Protection Buried Vias Type V versus Type VII
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Article
01/18/23
Let Me Vent!