Summit’s highly advanced manufacturing capabilities enable us to dependably build all types of PCB designs based on IPC standards. But we are never content with the status quo.
Our teams work alongside customers to push the boundaries of what is possible, helping to create truly astonishing electronic products.
Due to the growing complexity of design structures, high-density circuit boards (HDI) are becoming essential in today’s electronics. As products increase in functionality and decrease in size and weight, circuit board designers need new solutions to maximize the space on each board.
For example, although blind and buried vias and vias-in-pad add complexity to the design, these features add more functionality without adding space.Summit Interconnect has the expertise and HDI technology to route highest density designs.
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