Standard to Advanced Rigid PCBs

Summit’s integrated network of facilities manufactures rigid and high-density interconnect (HDI) PCBs, from simple multilayer designs to complex builds for mission-critical performance.

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Standard Rigid Printed Circuit Boards

Built on proven dielectric materials such as FR4, core rigid PCBs provide stable mechanical support, reliable electrical performance, and straightforward manufacturability. These boards are the cost-effective choice for designs that don’t require extreme density or advanced interconnect structures.

With decades of rigid PCB experience, Summit delivers consistent quality across simple through-hole boards to complex multilayers across all industries.

Key Attributes of Core or Standard Rigid PCBs

Stable performance with FR-4 and other standard dielectric cores
Through-hole via structures for straightforward interconnect
Scalable from single-sided to high-layer-count designs
Predictable thermal and electrical characteristics
Cost-effective solution for mainstream applications

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Advanced, High-Density
Interconnect (HDI) PCBs

Advanced HDI PCBs enable miniaturization, higher I/O density, and improved electrical performance through microvias, blind/buried vias, and sequential build-up layers.

With advanced laser drilling, sequential lamination, and fine-line imaging, Summit delivers precise, high-density boards. Our engineering teams work closely with customers to optimize stack-ups for scalable, manufacturable designs that meet performance demands.

Key Attributes of HDI Printed Circuit Boards

Microvia and build-up technology for high interconnect density
Fine trace/space rules supporting fine-pitch and high-pin-count devices
Improved electrical performance through shorter signal paths
Flexible layer stack-ups to balance size, performance, and reliability
Trusted for aerospace, defense, medical, and high-speed communications

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Capabilities

Rigid PCB capabilities highlights

Blind, Buried, and Microvia Structures

Enable dense interconnects without sacrificing board space. Summit features precision laser drilling for stacked and staggered microvia designs.
Sequential Lamination for Complex Stack-Ups

Support higher layer counts and advanced build-up structures. We specialize in multiple lamination cycles executed with tight process control.
Back-drilling and Stub Removal

Improve high-speed signal integrity by eliminating via stubs. Advanced equipment deliver cleaner signals in high-frequency applications.
Via Fill (Conductive and Non-Conductive)

Increase reliability, assembly yield, and flatness for fine-pitch components. Summit is experienced in via fills for HDI requirements.
Specialty Materials and Oversized Panels

Optimize performance with the right dielectric, PTFE, or hybrid laminate. We offer broad material expertise and oversized panel formats.
Impedance Control and DFM Support

Ensure signal integrity and manufacturability. Summit's in-house modeling, simulation, and collaborative engineering improve first-pass yield.

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Ultra HDI: The Next Frontier in PCB Design

Discover what ultra HDI is, why it matters, and how it’s shaping the future of PCB technology.

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We’re available to answer any questions

Email Us
info@summitinterconnect.com
Call Us
+1 (877) 264-0343

FAQ

Frequently asked questions.

Vias are critical to achieving high interconnect density, especially in HDI designs. Summit uses microvias, blind and buried vias, and via-in-pad structures to route complex circuits within tight spaces. These features reduce signal path length, improve electrical performance, and allow for higher component density without increasing layer count.
The annular ring is the copper pad area surrounding a drilled hole, and maintaining precise dimensions is essential for electrical and mechanical reliability. Summit’s laser and mechanical drilling processes, combined with tight registration control, ensure annular ring integrity in accordance with IPC-6012 Class 3 requirements, even on microvia and fine-pitch designs.
HDI PCBs support higher signal speeds by shortening trace lengths, reducing parasitic inductance, and enabling controlled impedance routing. This is critical for high-frequency and high-speed digital designs used in computing, telecommunications, and advanced electronics.
Building an HDI PCB often requires multiple sequential lamination cycles, laser drilling, copper filling, planarization, and precise imaging for fine-line features. Each step must be tightly controlled to maintain dimensional accuracy and electrical performance, especially for mission-critical applications.
We follow lean manufacturing principles, minimize scrap through precise process control, and use IPC standards to reduce rework and waste. By optimizing yields on complex builds, Summit supports both operational efficiency and environmental responsibility.