High-Density Rigid
Summit's rigid capabilities include HDI high-layer count boards, staggered microvias, blind/buried vias, back drilling, multiple sequential lam, via fill, metal backed/metal core, and oversized panel options.
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Rigid-Flex and Flex
As experts in rigid-flex and flex manufacturing, we handle rigid-flex, bookbinder, multilayer, adhesiveless & adhesive, stiffeners, laser ablation, thin flex laminates, assembly options and more.
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RF / Microwave
Our RF expertise includes using a wide range of PTFE materials, mixed material stackups, plated cavities, edge plating, high-temp lamination, mode suppression/stitching, buried resistors, and edge launch features.
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Semiconductor
We specialize in semiconductor reference cards, probe cards, DUT, and burn-in-boards. Our RF capabilities include high aspect ratio, low-loss materials, bondable gold, tight tolerance drilling, and sintering.
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Prototype Assembly
Experts in rigid-flex manufacturing: rigid-flex, bookbinder, multilayer, adhesiveless, and more.
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