June 28, 2023, Anaheim, CA – Summit Interconnect today announced the appointment of Brian Kamradt as chief financial officer. Kamradt brings over 20 years of finance, accounting, merger and acquisition, and IT experience to Summit’s leadership team. He will succeed Tom Caldwell, Summit’s initial CFO, who will be retiring after leading the company’s expansion for the past four years.

“Tom played a critical role in Summit’s development, and I wish to sincerely thank him for the significant contributions he’s made to our company,” said Shane Whiteside, CEO of Summit Interconnect. “He is a highly valued and respected colleague.”

Kamradt is a solutions-focused finance leader with proven success in leveraging technology to create scalable service operations. Most recently, as CFO and Head of IT at Jonathan Engineered Solutions, he was directly involved in multiple strategic acquisitions and expanding the use of technology in decision-making. Kamradt also gained significant manufacturing and international finance experience while serving as CFO for Nortek Security, VP of Finance at Curtiss-Wright Corporation, and VP of Finance for Meggitt/Parker.

“Brian clearly has extensive experience managing global financial operations,” said Whiteside. “He also has a track record of implementing transformative business processes that will help accelerate our business initiatives and advance Summit’s industry leadership position. We are pleased to have him on our team.”

Kamradt joins Summit Interconnect at a pivotal time in the printed circuit board (PCB) industry’s evolution. Challenges to supply chains, a tight labor market, and a renewed focus on regional manufacturing has prompted the introduction of government legislation aimed at increasing the production of PCBs in North America.

“I am honored to be joining Summit and am inspired by the company’s vision and purpose,” said Brian Kamradt, CFO at Summit. “Summit’s powerful combination of people, products, and technology is unmatched in the industry. I look forward to working with all the teams to further accelerate growth and create even greater value for our customers and stakeholders.”

Kamradt holds a Master’s in Business Administration from ESADE in Barcelona, Spain, and a Bachelor of Arts in Economics and International Management from Hamline University, St. Paul, Minnesota. He is fluent in English, Spanish, and Catalan.

About Summit Interconnect: Summit Interconnect is the largest, privately held PCB manufacturer in North America. The company is focused on the fast-growing defense and high-performance commercial sectors in the North American market.  Summit offers solutions ranging from advanced cutting-edge prototyping to complex high mix, low-to-mid volume production.  Summit’s eight facilities are located across California, Illinois, Colorado, and Toronto, Canada. For more information, please visit  summitinterconnect.com.

Media Contact: Lisa Holmes, Director of Marketing, Summit Interconnect, 303-307-9909, lisa.holmes@summitinterconnect.com.

Aspiring young professionals began their interships at Summit’s Santa Ana location. The day was filled with orientation sessions, team introductions, and a tour of the facility.

The day began with a comprehensive orientation session where the interns were provided with an overview of Summit’s history, mission, and values. They learned about the various departments and functions within the organization, gaining insight into the diverse opportunities that await them. This session served as a platform for the interns to understand the culture at Summit and align their aspirations with the company’s vision.

Following the orientation, the interns were introduced to their respective teams. Through these interactions, the interns got a sense of the collaborative work environment at Summit The teams welcomed them warmly and expressed their eagerness to guide and support them throughout the program.

One of the highlights of the day was a tour of Summit’s Santa Ana location. The interns explored the various departments, witnessing firsthand the behind-the-scenes operations involved in manufacturing PCBs. The interns were showns the state-of-the-art technology and cutting-edge machinery present throughout the facility. They received an explanation of the manufacturing process and the meticulous attention to detail that goes into every product.

The interns at Summit’s Santa Ana location have embarked on an incredible journey as part of the Internship Program. With the orientation complete and teams assigned, they are now equipped to dive headfirst into their designated roles, honing their skills, and making a meaningful impact.

The students are from:

• California State University, Long Beach
• University of California, Irvine
• California Polytechnic University, Ponona
• Benedictine College, Atchison, KS