Irvine, CA – February 20, 2025 – Summit Interconnect, a leading provider of advanced printed circuit board (PCB) solutions, is pleased to announce that Leo LaCroix has joined the company as Vice President of Aerospace & Defense Operations. In this role, LaCroix will oversee operational strategy, customer engagement, and manufacturing excellence for Summit’s aerospace and defense-focused facilities, driving continued growth and innovation in the sector.

LaCroix brings more than 25 years of leadership experience in complex manufacturing environments, with deep expertise in PCB technologies, operations management, and supply chain optimization. He has successfully led multi-facility teams across North America and Asia, spearheading initiatives in lean manufacturing, process improvement, and advanced technology development.

“Leo’s extensive experience in PCB manufacturing, coupled with his proven ability to drive operational excellence, makes him a tremendous addition to the leadership team at Summit Interconnect,” said Shane Whiteside, CEO of Summit Interconnect. “As we continue to strengthen our partnerships within the A&D industry, his leadership will be instrumental in enhancing our capabilities and delivering outstanding value to our customers.”

Prior to joining Summit Interconnect, LaCroix served as Executive Vice President of the Circuits Division at Firan Technology Group, where he was instrumental in integrating and optimizing the company’s U.S.-based facilities. His leadership resulted in significant revenue growth, operational efficiencies, and strategic positioning within the aerospace and defense sector. He also held senior leadership roles at Sanmina Corporation and Viasystems, where he was instrumental in driving profitability, securing major defense contracts, and advancing PCB manufacturing capabilities.

LaCroix expressed his enthusiasm for joining Summit Interconnect, stating: “I am excited to be part of a company that is committed to innovation and excellence in PCB manufacturing. Summit Interconnect has a strong reputation for best-in-class solutions, and I look forward to working with this outstanding team to drive continuous process improvements, expand our technological capabilities, and exceed our customers’ expectations.”

LaCroix holds a Bachelor’s degree in International Economy and Policy Studies from the University of Wisconsin–Madison with a concentration in International Business and multiple professional certifications in supply and operations management, including a Lean Six Sigma Black Belt.

For more information about Summit Interconnect and its industry-leading PCB solutions, please visit www.summitinterconnect.com.

Summit Interconnect is excited to announce the installation of a second Nikon XT V160 X-ray system in our Denver-based assembly facility. This state-of-the-art equipment enhances our ability to conduct high-precision inspections on complex printed circuit board assemblies (PCBAs), ensuring the highest level of quality for our customers. By leveraging automated pass/fail inspection and advanced imaging technology, this addition reinforces our commitment to innovation and reliability in PCB manufacturing.

Nikon XT V160 brings superior imaging capabilities, allowing us to capture clearer, high-resolution X-ray images of PCB components and assemblies. This level of detail is essential for identifying potential defects, verifying component placement, and ensuring compliance with stringent industry standards. The ability to provide customers with detailed X-ray scans on request further strengthens the transparency and trust in our processes.

With this second installation, Summit Interconnect significantly increases operational redundancy, ensuring that even if one system requires maintenance, assembly operations remain uninterrupted. This redundancy helps eliminate bottlenecks in the facility, enhancing throughput and efficiency while improving turnaround times for our customers. By reducing the risk of production delays, we continue to support the fast-paced demands of industries that rely on our cutting-edge PCB solutions.

Investing in advanced non-destructive testing (NDT) solutions like the Nikon XT V160 reflects our ongoing commitment to maintaining the highest quality standards. This latest upgrade not only improves our manufacturing processes but also supports our customers by delivering reliable, high-performance PCB assemblies with unmatched precision and confidence.

Stay tuned as we continue to implement the latest advancements in PCB technology to serve our customers better.

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