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Assembly 06/12/24

Summit Interconnect Announces the Appointment of David Lane as New General Manager and Vice President of Denver-based Advanced Assembly, A Summit Interconnect Company

Summit Interconnect Announces the Appointment of David Lane as New General Manager and Vice President of Denver-based Advanced Assembly, A Summit Interconnect Company

Mr. Lane Adds More Than 25 Years of Engineering, Manufacturing, Operations, and Sales Experience to the Organization

June 10, 2024, Irvine, CA – Summit Interconnect, a leading provider of advanced PCB manufacturing, today announced that David Lane recently joined the company as General Manager and Vice President. In this position, he oversees all aspects of operations within Summit’s Denver-based facility, Advanced Assembly.

Lane is an industry veteran with over 25 years of hands-on experience in operations and management. He joins Summit Interconnect after serving as the Director of Global Key Accounts at Universal Instruments Corporation, where he played a pivotal role in driving business growth and enhancing customer relationships. Before that, he held key executive positions at Creation Technologies, NEO Technology Solutions (OnCore Manufacturing, LLC.), DDi (Dynamic Details, Inc), McData Corporation, and Compaq Computers.

“We are thrilled to welcome David Lane to Summit Interconnect as the new General Manager of our assembly division,” said Sean Patterson, COO of Summit Interconnect. “David’s extensive experience and proven leadership will be invaluable assets as we expand our capabilities and continue delivering superior products and services to our customers.”

Throughout his career, David has demonstrated exceptional skills in operations management, business strategy, customer relationship management (CRM), and team leadership. He has a long history of building and leading technical organizations, manufacturing operations teams, and cross-functional teams focused on delivering innovative solutions and driving continuous improvement initiatives.

“I am excited to join Summit Interconnect and lead the assembly team,” said David Lane. “I look forward to collaborating with the talented individuals at Summit Interconnect and leveraging our collective expertise to drive innovation, exceed customer expectations, and achieve operational excellence.”

Lane holds a B.S. in Mechanical Engineering from Colorado State University.

Advanced Assembly, a Summit Interconnect company, will change its name to Summit Interconnect Assembly later this year.

About Summit Interconnect

Summit Interconnect is the largest, privately held PCB manufacturer in North America. The company is focused on the fast-growing defense and high-performance commercial sectors in the North American market.  Summit offers solutions ranging from advanced cutting-edge prototyping to complex high mix, low-to-mid volume production.  Summit’s eight facilities are located across California, Illinois, Colorado, and Toronto, Canada. For more information, please visit

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