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News 06/27/23

Summit Interconnect Welcomes Brian Kamradt as New CFO

June 28, 2023, Anaheim, CA – Summit Interconnect today announced the appointment of Brian Kamradt as chief financial officer. Kamradt brings over 20 years of finance, accounting, merger and acquisition, and IT experience to Summit’s leadership team. He will succeed Tom Caldwell, Summit’s initial CFO, who will be retiring after leading the company’s expansion for the past four years.

“Tom played a critical role in Summit’s development, and I wish to sincerely thank him for the significant contributions he’s made to our company,” said Shane Whiteside, CEO of Summit Interconnect. “He is a highly valued and respected colleague.”

Kamradt is a solutions-focused finance leader with proven success in leveraging technology to create scalable service operations. Most recently, as CFO and Head of IT at Jonathan Engineered Solutions, he was directly involved in multiple strategic acquisitions and expanding the use of technology in decision-making. Kamradt also gained significant manufacturing and international finance experience while serving as CFO for Nortek Security, VP of Finance at Curtiss-Wright Corporation, and VP of Finance for Meggitt/Parker.

“Brian clearly has extensive experience managing global financial operations,” said Whiteside. “He also has a track record of implementing transformative business processes that will help accelerate our business initiatives and advance Summit’s industry leadership position. We are pleased to have him on our team.”

Kamradt joins Summit Interconnect at a pivotal time in the printed circuit board (PCB) industry’s evolution. Challenges to supply chains, a tight labor market, and a renewed focus on regional manufacturing has prompted the introduction of government legislation aimed at increasing the production of PCBs in North America.

“I am honored to be joining Summit and am inspired by the company’s vision and purpose,” said Brian Kamradt, CFO at Summit. “Summit’s powerful combination of people, products, and technology is unmatched in the industry. I look forward to working with all the teams to further accelerate growth and create even greater value for our customers and stakeholders.”

Kamradt holds a Master’s in Business Administration from ESADE in Barcelona, Spain, and a Bachelor of Arts in Economics and International Management from Hamline University, St. Paul, Minnesota. He is fluent in English, Spanish, and Catalan.

About Summit Interconnect: Summit Interconnect is the largest, privately held PCB manufacturer in North America. The company is focused on the fast-growing defense and high-performance commercial sectors in the North American market.  Summit offers solutions ranging from advanced cutting-edge prototyping to complex high mix, low-to-mid volume production.  Summit’s eight facilities are located across California, Illinois, Colorado, and Toronto, Canada. For more information, please visit  summitinterconnect.com.

Media Contact: Lisa Holmes, Director of Marketing, Summit Interconnect, 303-307-9909, lisa.holmes@summitinterconnect.com.

 

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