We manufacture a broad range of PCB types and technologies for a one-stop solution
High-Density Rigid
Summit’s rigid capabilities include HDI high-layer count boards, staggered microvias, blind/buried vias, back drilling, multiple sequential lam, via fill, metal backed/metal core, and oversized panel options.
Rigid-Flex and Flex
As experts in rigid-flex and flex manufacturing, we handle rigid-flex, bookbinder, multilayer, adhesiveless & adhesive, stiffeners, laser ablation, thin flex laminates, assembly options and more.
RF / Microwave
Our RF expertise includes using a wide range of PTFE materials, mixed material stackups, plated cavities, edge plating, high-temp lamination, mode suppression/stitching, buried resistors, and edge launch features.
Semiconductor
We specialize in semiconductor reference cards, probe cards, DUT, and burn-in-boards. Our RF capabilities include high aspect ratio, low-loss materials, bondable gold, tight tolerance drilling, and sintering.
Prototype Assembly
Experts in rigid-flex manufacturing: rigid-flex, bookbinder, multilayer, adhesiveless, and more.
A few of the markets we serve
Aerospace & Defense
Summit is one of the most trusted suppliers for key defense programs with advanced technologies across a wide spectrum of platforms. We maintain ITAR registration and certifications for AS9100 AQMS, Nadcap, and Mil Spec.
Computing & Datacom
Summit is on the leading edge in the use of modern materials and HDI processes to meet the high-speed digital signal integrity requirements of the computing and datacom markets.
Medical
Summit has proven experience meeting the manufacturing requirements for medical electronic products including miniaturization with thin dielectrics, laser drilled vias and tight tolerances.
Semiconductor
Summit has extensive experience supporting the semiconductor industry across many applications including ATE boards, probe cards, reference boards, and substrates.
Space
Our material expertise and manufacturing knowledge allow Summit’s factories to support 6012/6018 Space Addendum for complex designs of space applications.
Automotive & Transportation
Today’s automobiles and electric vehicles are complex products that require advanced electronic components for operations. We are experienced in meeting these complex requirements.
Consumer Electronics
We have proven experience meeting the manufacturing requirements for electronic products including miniaturization and tight tolerances.
Technical Webinars
Global reach, local impact
Summit Interconnect’s facilities feature cutting-edge capabilities, ultra-efficient processes, the most experienced teams, and a culture dedicated to exceeding expectations.
- 8 North American locations
- 7 connected high-tech facilities
- 1,250+ employees
Sustainability in PCB Design: Insights from Summit Interconnect at IPC APEX EXPO 2025
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Driving PCB Innovation with Advanced Materials and Automation
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The Key to First-pass Success in PCB Design
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Summit Interconnect Announces Key Executive Appointments
Sean Patterson Named Chief Technology Officer, Michael Norman Joins as President and Chief Operating Officer March 6 …
Kapton: Applications & Benefits in PCB Manufacturing
Kapton, a high-performance polyimide film, is widely used in PCB manufacturing due to its exceptional …