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Feb 22, 2024 11:00 AM

RECORDING: What’s New in IPC 6012 Revision F?

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In this webinar, Gerry Partida, our Vice President of Technology, discusses what is new in IPC 6012 Revision F. Revision F covers qualification and performance specifications for rigid PCBs. Topics covered in this webinar include:

  • Design considerations when a design has back drills in plated holes.
  • New rules specifically addressing the incorporation of cavities within PCB designs.
  • Requirements of edge plating that has been added to edges
  • Changes in default requirements for Surface Finish ENIG, Dielectric Separation, and Lead Free Solder Coated Finish.
  • Evidence of Etchback and Minimum Dielectric Spacing
  • And much more!

Enter your name and email address in the Zoom Registration Page below, and you will receive the link to the live Webinar being hosted on February 22nd at 11:00 PST.

 

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Join our VP of Technology, Gerry Partida, as he discusses the challenges of delamination in HDI Design. In this 45-minute webinar exclusively for Summit Interconnect customers, Gerry shares why modern HDI designs with…

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22 May
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RECORDING: Addressing the Challenges of PCB Design for Manufacturing

We had an excellent turnout at our latest webinar in the series, where we discussed Addressing the Challenges of PCB Design for Manufacturing along with CoFactr. Some topics that were covered include: Common…

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