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Jul 25, 2024 11:00 AM

Webinar: The Proliferation of Electronics into Harsh Environments and the Effects on Reliability

Register Today

For the past 30 years, the use of no-clean fluxes has, for
many assemblers, resulted in the successful abandonment
of post-reflow cleaning.

Today, an increasing number of assemblers are restoring
their long-abandoned cleaning process, so much so, that
cleaning is now considered by many assemblers, once
again, to be a mainstream assembly process.

This presentation will review the reasons cleaning, for many
assemblers, was abandoned, the reasons that decision was
largely successful for such a long time, and the reasons why
that success has faded.

The webinar will be hosted by Summit Interconnect and will be taking place at 11 AM PST, July 25th 2024. Register below.

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Join our VP of Technology, Gerry Partida, as he discusses the challenges of delamination in HDI Design. In this 45-minute webinar exclusively for Summit Interconnect customers, Gerry shares why modern HDI designs with…

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22 May
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RECORDING: Addressing the Challenges of PCB Design for Manufacturing

We had an excellent turnout at our latest webinar in the series, where we discussed Addressing the Challenges of PCB Design for Manufacturing along with CoFactr. Some topics that were covered include: Common…

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