Managing heat in PCB design is critical for performance, reliability, and product longevity. Join Summit Interconnect for an insightful webinar where we explore progressive thermal management techniques—from fundamental material choices to advanced heat dissipation solutions.
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07
NOV
Nov 07, 2024 11:00 AM PT
WEBINAR: Best Practices for HDI and Sub-Lamination Structures
High-density interconnect (HDI) and sub-lamination PCBs provide enhanced functionality and compact designs. In this webinar, industry veteran Gerry Partida, Summit's Vice President of Technology, discusses important design best practices for HDI and sub-lamination…
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