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Best Practices for HDI and Sub-Lamination Structures
High-density interconnect (HDI) and sub-lamination PCBs provide enhanced functionality and compact designs. In this webinar, industry veteran Gerry Partida, Summit’s Vice President of Technology, discusses important design best practices for HDI and sub-lamination structures.
Recording
Nov 7, 2024 11:00 AM PT
Nov 7, 2024 11:00 AM PT
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