We had an excellent turnout at our latest webinar in the series, where we discussed Addressing the Challenges of PCB Design for Manufacturing along with CoFactr.
Some topics that were covered include:
The webinar recording will be uploaded here soon. In the meantime, please feel free to download the attached Design Rules Guide, published by Cofactr.
Join us for our next technical webinar on June 20th at 11 am PT, where our VP of Technology, Gerry Partida, will discuss HDI Design and Venting considerations alongside his panel.
This exclusive webinar will explore the evolving landscape of high-density PCBs.
Register HereManaging heat in PCB design is critical for performance, reliability, and product longevity. Summit Interconnect's webinar explored progressive thermal management techniques—from fundamental material choices to advanced heat dissipation solutions.
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